This Potting and Encapsulating Compounds report offers the market share from different countries and regions. Top key market players market share analysis are included in the report. The market observations such as constraints, drivers, threats, opportunities, investment opportunities, challenges, and recommendations are included in the report.
Global Potting And Encapsulating Compounds Market is expected to rise in the forecast period of 2019-2026.Global Potting and Encapsulating Compounds Market By Type (Epoxy Resin, Polyurethane Resin, Silicone Resin, Polyester System, Polyamide), Application (Electronics, Electrical), Curing technique (Room Temperature Cured, High Temperature or Thermally Cured, UV Cured), End user industry (Consumer Electronics, Transportation, Energy & Power, Solar Power, Others), Geography (North America, South America, Europe, Asia-Pacific, Middle East and Africa) – Industry Trends and Forecast to 2026 Few of the major competitors currently working in the global potting and encapsulating compounds market are Henkel Adhesives Technologies India Private Limited, Dymax Corporation, Master Bond Inc., Electrolube
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Global potting and encapsulating compounds market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of potting and encapsulating compounds market for global, Europe, North America, Asia Pacific, South America and Middle East & Africa. Key Market Competitors: CHT UK Manchester Ltd, EFI Polymers, Epic Resins, INTERTRONICS., MG Chemicals., NAGASE & CO., LTD, ALTANA, Glatt GmbH, Tate & Lyle, Groupe Legris Industries, BÜCHI Labortechnik AG, Archer Daniels Midland Company, Lycored, Ingredion Incorporated, AVEKA, Inc., , Cargill, Incorporated , Carmi Flavor & Fragrance Co., Inc, FONA International Inc, and others
Potting component is highly dielectric materials and is generally used in electronic and electrical devices which provide electrical insulation and protection against harsh environmental conditions such as moisture and fire flames. Whereas encapsulation is a method of assembling an electronic device with a solid compound to protect against corrosion, shock, moisture, and vibration. They are majorly used for various applications in electronic and electrical industry and these devices have capability to work under heat, stress, and attain a low outgassing performance.
- Due to increase in spending by industries such as consumer electronics and transportation is driving the growth of the market.
- Increase in demand due to Encapsulation’s various benefits such as protecting flavour particularly from oxidation, evaporation, moisture uptake etc.
- Rapid growth in energy and power industry in also expected to act as a driver for the market growth
- Strict government regulations and legal norms which restraint the growth of the market.
- The addition cost incurred in Encapsulation acts as market restraints and also hamper the growth.
Global Potting and Encapsulating Compounds Market Segmentation:
(Epoxy Resin, Polyurethane Resin, Silicone Resin, Polyester System, Polyamide)
Curing technique (Room Temperature Cured, High Temperature or Thermally Cured, UV Cured)
End user industry
(Consumer Electronics, Transportation, Energy & Power, Solar Power, Others)
Key Insights in the report:
- Complete and distinct analysis of the market drivers and restraints
- Key Market players involved in this industry
- Detailed analysis of the Market Segmentation
- Competitive analysis of the key players involved
Focal point of the report
- To gain insights of the Changing market dynamics of the industry
- Major players and brands
- Historical and current market size and projection up to 2026.
- It provides five-year forecast assessed on the basis of how the market is predicted to grow
- Strategies of key players and product offerings
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